Electroplated pad conditioning dresser for semiconductor polishing pad
This wheel is used for dressing/conditioning the polishing pads used in the flattening process of semiconductor devices.
Electroplated the appropriate abrasive grains of the selected diamond to a base metal brings stable dressing/conditioning, and results in reduced individual differences.
Work materials: Urethan pad, Non-woven fabric pad, Suede pad, which are semiconductor polishing pad
Grain size range of pad dressers (average grain size)
Specifications of pad dresser production
- *Outer Diameter: ~φ740D(29B)
- *Base accuracy: Flatness ≤ 0.3 Set tolerance ≤ 0.05
- *Base materials: SUS304, SUS420
- *Base coating: With or without Teflon coating
- *Electroplated surface: One side or both side
- *Abrasive grain: Diamond (Blocky type and others)
- *Particle size: #60 ~ 400