Diamond notch wheel for semiconductor wafers
This wheel is used for chamfering and finishing the notch of semiconductor wafers. The runout accuracy of the diamond layer to the shank is excellent due to our original processing technology. In addition to silicon wafers, we also provide wheels with various specifications for compound semiconductor wafers such as SiC (silicon carbide) and LT (lithium tantalate), which are becoming larger nowadays, and for quartz wafers.
[Applicable materials for diamond notch wheels]
Silicon, SiC (silicon carbide), LT (lithium tantalate), LN (lithium niobate), Quartz, and Sapphire
Image of Groove Shape of Diamond Notch Wheel
Reference sizes and specifications for diamond notch wheels
- Grain size : #400 - #3000
- *It is possible to manufacture wheels usable for both roughing and finishing.
- Outer diameter : Up to φ4 ( Groove bottom diameter Min φ2 )
- Shank diameter tolerance : h6
- Total length : Up to 35L
- Deflection accuracy : ≥ 5 um @Min
- Groove angle tolerance: Tolerance ≥ 0.5 degrees (one side angle)
- Number of grooves : Up to 5 grooves
Longer life of finishing notch wheels for silicon wafers
[Issues in notch processing of silicon wafers]
The demand for quality in the notch area of silicon wafers has been increasing year by year, and the notch wheel abrasive grains with a higher grain size number are increasingly being used. The challenge is to increase the service life of notch wheels that use abrasive grains with high grain size such as #3000.
[Solution with metal bond notch wheel]
Although the life of the notch wheel tends to become shorter due to the higher grain size number, the life can be enhanced by improving the hardness and strength of the notch wheel bond. In addition, the use of our original dressing technology AD-C allows for further improvement in service life.
We can provide notch wheels that are compatible with various types of wafers, including compound semiconductors.
We are also working on the development of high-precision beveling wheels and notch wheels for silicon wafers.
Life Comparison Test with Conventional Wheel
Significant life improvement was achieved with #3000.
Compared with the conventional bond & stick general dressing, the new bond & unique dressing (AD-C) has achieved a significant improvement in life, especially for #3000.
Optimal grinding tools for notch grinding of silicon wafers
Metal bond notch wheel for semiconductor wafers
[Possible production range]
Grain size : #400 – #3000
Outer diameter : Up to 4D (Min 2D)
Shank diameter tolerance: h6
Total length : Up to 35L
Deflection accuracy : ≧ 5 um @Min.
Groove shape tolerance : ≧ 1 degrees @ aperture angle
Number of grooves : Up to 5 grooves
This wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology realizes high swinging accuracy of the diamond part against the shank. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror beveling are also available.