[Issues in rough machining of SiC wafers]

The production of compound semiconductor wafers, which are used as substrates for power devices, is expected to grow steadily in the trend toward power saving in a low-carbon society. The key to this growth is the processing cost of wafers, which requires a longer wheel life due to the large amount of allowance in the rough machining prior to surface grinding.

[Solution with porous vitrified bond wheel]

Our porous vitrified bond wheel “VEGA” has both a larger pore diameter and a higher porosity than conventional wheels, maximizing the biting performance to work materials. It is particularly suitable for surface grinding of SiC wafers and can grind 6″ SiC wafers without dressing. The excellent wear resistance increases the number of wafers that can be machined per wheel and contributes to the reduction of wafer machining costs.